Intel’s Advanced Packaging: Revolutionizing Chip Packaging Technology

Over half a century  ago, when Gordon Moore was digging to explore the science behind integrated circuits, he had no idea that what he was about to explore would lead to change the definition of technology and the way it would affect the entire humanity in all life aspects. Moore’s law, the seed that flourished peoples’ lives with high mega pixels camera, all sorts of sensors, and facilitated the research of different other technologies that changed the identity of human world, kicks back again with a revolutionizing technology that brings a new generation of chip packaging. 

Completing what Moore originally started, many of his dedicated students in Intel followed his path of determination in drawing a future that is even beyond imagination and making sure it sees the light with the best possible application. Intel held a roundtable in which experts discussed the corporate’s adopted strategy in advanced packaging and the capabilities this technology offers its customers. 

Advanced packaging is a set of technologies that combines and interconnects multiple chips in one package. It allows users to benefit from a much faster performance with remarkably less cost.  

The primarily matrix of driving technical solution mainly relies on three factors: the performance of the technology, the scale of using it, and its cost. The newly improved technology also marks a turning point in offering cutting-edge technology at a competitive price in the market. Intel explained that In addition to cost-savings, advanced packaging allows chip architects to build devices with better performance and more functionality that would otherwise not be possible.  Intel® Data Center GPU Max is an example of a product that cannot be built without advanced packaging.