3D IC and 2.5D IC Market Anticipated To Grow At A Healthy Rate In 2018 to 2025
© daksha kumar
This report studies the global 3D IC and 2.5D IC market status and forecast, categorizes the global 3D IC and 2.5D IC market size (value & volume) by key players, type, application, and region. This report focuses on the top players in North America, Europe, China, Japan, Southeast Asia India and Other regions (Middle East & Africa, Central & South America).
In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
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3D TSV in 3D IC and 2.5D IC market is estimated to grow at the highest CAGR during the forecast period
In terms of geographic regions, Asia-Pacific acquired largest market for 3D IC and 2.5D IC in 2018.The large market in Asia-Pacific is owing to the broad scope of 3D IC and 2.5D IC packages in various consumer electronics applications, particularly in smartphones and tablets.
The global 3D IC and 2.5D IC market is valued at xx million US$ in 2017 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2018-2025.
The major players covered in this report
• TSMC (Taiwan)
• Samsung (South Korea)
• Toshiba (Japan)
• ASE Group (Taiwan)
• Amkor (U.S.)
• UMC (Taiwan)
• Stmicroelectronics (Switzerland)
• Broadcom (U.S.)
• Intel (U.S.)
• Jiangsu Changjiang Electronics (China)
Browse Full Report with TOC @ https://www.marketexpertz.com/industry-overview/3d-ic-and-25d-ic-market
Geographically, this report studies the key regions, focuses on product sales, value, market share and growth opportunity in these regions, covering
• United States
• Europe
• China
• Japan
• Southeast Asia
• India
We can also provide the customized separate regional or country-level reports, for the following regions:
• North America
• United States
• Canada
• Mexico
• Asia-Pacific
• China
• India
• Japan
• South Korea
• Australia
• Indonesia
• Singapore
• Rest of Asia-Pacific
• Europe
• Germany
• France
• UK
• Italy
• Spain
• Russia
• Rest of Europe
• Central & South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Saudi Arabia
• Turkey
• Rest of Middle East & Africa
On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
• 3D wafer-level chip-scale packaging
• 3D TSV
• 2.5D
On the basis on the end users/applications, this report focuses on the status and outlook for major applications/end users, sales volume, market share and growth rate for each application, including
• Consumer electronics
• Telecommunication
• Industry sector
• Automotive
• Military and Aerospace
• Smart technologies
• Medical devices
Read More Categories Reports @ https://www.marketexpertz.com/report/category/Electronics-services
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Media Relations Contact
John Watson (Sales Manager)
Call +1-800-819-3052
Address: 40 Wall St. 28th Floor New York City,
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Email: sales@marketexpertz.com
Websites: https://www.marketexpertz.com
In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
Download Free Sample Report @ https://www.marketexpertz.com/sample-enquiry-form/13012
3D TSV in 3D IC and 2.5D IC market is estimated to grow at the highest CAGR during the forecast period
In terms of geographic regions, Asia-Pacific acquired largest market for 3D IC and 2.5D IC in 2018.The large market in Asia-Pacific is owing to the broad scope of 3D IC and 2.5D IC packages in various consumer electronics applications, particularly in smartphones and tablets.
The global 3D IC and 2.5D IC market is valued at xx million US$ in 2017 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2018-2025.
The major players covered in this report
• TSMC (Taiwan)
• Samsung (South Korea)
• Toshiba (Japan)
• ASE Group (Taiwan)
• Amkor (U.S.)
• UMC (Taiwan)
• Stmicroelectronics (Switzerland)
• Broadcom (U.S.)
• Intel (U.S.)
• Jiangsu Changjiang Electronics (China)
Browse Full Report with TOC @ https://www.marketexpertz.com/industry-overview/3d-ic-and-25d-ic-market
Geographically, this report studies the key regions, focuses on product sales, value, market share and growth opportunity in these regions, covering
• United States
• Europe
• China
• Japan
• Southeast Asia
• India
We can also provide the customized separate regional or country-level reports, for the following regions:
• North America
• United States
• Canada
• Mexico
• Asia-Pacific
• China
• India
• Japan
• South Korea
• Australia
• Indonesia
• Singapore
• Rest of Asia-Pacific
• Europe
• Germany
• France
• UK
• Italy
• Spain
• Russia
• Rest of Europe
• Central & South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Saudi Arabia
• Turkey
• Rest of Middle East & Africa
On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
• 3D wafer-level chip-scale packaging
• 3D TSV
• 2.5D
On the basis on the end users/applications, this report focuses on the status and outlook for major applications/end users, sales volume, market share and growth rate for each application, including
• Consumer electronics
• Telecommunication
• Industry sector
• Automotive
• Military and Aerospace
• Smart technologies
• Medical devices
Read More Categories Reports @ https://www.marketexpertz.com/report/category/Electronics-services
About Us
Planning To Invest In Market Intelligence Products Or Offerings On The Web? Then Marketexpertz Has Just The Thing For You - Reports From Over 500 Prominent Publishers And Updates On Our Collection Daily To Empower Companies And Individuals Catch-Up With The Vital Insights On Industries Operating Across Different Geography, Trends, Share, Size And Growth Rate. There's More To What We Offer To Our Customers. With Marketexpertz You Have The Choice To Tap Into The Specialized Services Without Any Additional Charges. Our in-house research specialists exhibit immense knowledge of not only the publisher but also the types of market intelligence studies in their respective business verticals.
Media Relations Contact
John Watson (Sales Manager)
Call +1-800-819-3052
Address: 40 Wall St. 28th Floor New York City,
Ny 10005 United States
Email: sales@marketexpertz.com
Websites: https://www.marketexpertz.com